Building Chips in America Act of 2023

Summary

Building Chips in America Act of 2023 This bill modifies and limits the review of certain semiconductor (i.e., microchip) projects under the National Environmental Policy Act of 1969 (NEPA) and the National Historic Preservation Act (NHPA). Specifically, the bill exempts from NEPA and NHPA specified semiconductor projects that receive financial assistance under the William M. (Mac) Thornberry National Defense Authorization Act for Fiscal Year 2021. Next, the bill allows the Department of Commerce to serve as the lead agency for the review of a semiconductor project that receives such financial assistance but is not exempted from review under NEPA. A single environmental document and joint record of decision must be prepared for a semiconductor project. In completing the environmental review, Commerce may adopt a prior study or decision under certain circumstances. The bill also allows a state to assume the responsibility of an environmental review under NEPA for a semiconductor project. Finally, the bill sets a statute of limitations for certain claims under NEPA.

This text is taken from the official record. PoliticalRepo does not editorialize.

Timeline

1. 11 July 2023

   Introduced

   Introduced in House

   Source: IntroReferral

2. 11 July 2023

   Introduced

   Referred to the Committee on Science, Space, and Technology, and in addition to the Committees on Energy and Commerce, Armed Services, and Natural Resources, for a period to be subsequently determined by the Speaker, in each case for consideration of such provisions as fall within the jurisdiction of the committee concerned.

   Source: IntroReferral

3. 11 July 2023

   Introduced

   Introduced in House

   Source: IntroReferral

4. 14 July 2023

   Referred

   Referred to the Subcommittee on Innovation, Data, and Commerce.

   Source: Committee

Votes

No vote records are attached yet.

Versions

• Introduced in House · 11 July 2023 · Download file

Documents

3 official files

• Introduced in House (text)

  Introduced in House · EN · 11 July 2023

  ViewDownloadOpen at official source

• Introduced in House (PDF)

  Introduced in House · EN · 11 July 2023

  ViewDownloadOpen at official source

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• Introduced in House

  summary · EN · 11 July 2023

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  Vertaal document

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Sponsors

• Rep. Kiggans, Jennifer A. [R-VA-2] · R · Sponsor
• Rep. Peters, Scott H. [D-CA-50] · D · Sponsor
• Brandon Williams · R · Sponsor
• Colin Allred · D · Sponsor
• Rep. McCaul, Michael T. [R-TX-10] · R · Sponsor
• Sen. Slotkin, Elissa [D-MI] · D · Cosponsor
• Rep. Sykes, Emilia Strong [D-OH-13] · D · Cosponsor
• Sen. Gallego, Ruben [D-AZ] · D · Cosponsor
• Rep. Carter, Earl L. "Buddy" [R-GA-1] · R · Cosponsor
• Rep. Lawler, Michael [R-NY-17] · R · Cosponsor
• Rep. Stanton, Greg [D-AZ-4] · D · Cosponsor
• Mike Garcia · R · Cosponsor
• Rescom. González-Colón, Jenniffer [R-PR-At Large] · R · Cosponsor
• · hsif00 · Standing
• · hsii00 · Standing
• · hsas00 · Standing
• · hssy00 · Standing

Related records

• related to ← Building Chips in America Act of 2023